B3CV-12-C kg Hollow shaft for shrink disk HDV H C Bevel-helical speed reduction gearboxes B3

Flender/Flender Gear Units/Bevel-helical speed reduction gearboxes B3

per, levelling of build-ups with heated flat stamp, removal of the workpiece. The relationship between the parameters (temperature, stamping pressure and stamping time) is decisive for the quality of hotstamping. (primarily cylindrical surfaces) 7 3.3 Development of an inexpensive manufacturing process for stamping blocks In the course of development work, it became evident that the manufacture of the stamping block has considerable influence on the quality of stamping as regards contour accuracy, material structure and heat transfer Master patterns or films are usually the basis for the profile of the stamp geometry With the help of newly developed manufacturing process, the blocks are either assembled from modules, or cut from sheet steel using laser technology These individual arts are ass- embled on steel plate and filled with high temperatureresistant (over 3 "Cyepoxy resin This manufacturing process was patented during the course of the project Demands on the substrates Printed conductor substrates In principle,all thermoplasticsand cardboards which tolerateat least brief heating upto thesol- dering temperature and can be produced with adequate dimensional accuracy, such as PC, PA, PAR, PBT, PET, can be used as substrates forthe printed conductors The materials can be rein- forced with glass fibres Printed conductor substrates - Further processing Further processing techniques for PCBs with hot-stamped integrated printed conductors are soldering, drilling and preservation of the printed conductors During the course of this research project, pilot installation for continuous production of the hot-stamping foil (Cu backin sheet) and laminating machine for application of the various layers (parting and adhesiveyayers) were developed. This pilot installation was the basis for the design of the mass-production installation pilot installation was also built for the semi-automatic hotstamping method 3.4 Prospects for product design