Flender/Flender Gear Units/Bevel-helical gear Reduction Boxes B3
olecular sieve (Chro- mosorb , thermally desorbed, and analyzed showed that the major odor compounds from these fungi were 1-octanol,

3-octanone, and 3-methyl-1-butanol (. Maximal lev-els were observed after 7 weeks, octanol was the main component, 3-octanone accountedfor 5%8% of

total volatiles, and 3-methyl-1-butanol was either absent or present in trace(/H1%) amounts. Volatile levels decreased substantially after 1 days of

incubation. The 5 Alvo et al. total fungal propagule count rose initially, peaked at 2 weeks, then decreased before rising

slowly through the remainder of the incubation. Thus the maximum in volatilesappears to have occurred in the lull between the initial growth burst of the fungi and thelater gradual rise in fungal population. Similar volatile production patterns have beenreported in stored barley (, with greater emission levels at 2% moisture content (..) than at 1% .. barley. The fungal odor compounds 3-methyl-1-butanol, 1-octen-3-ol, and 3-octanone were monitored in experimental wheat storage bins (. Wheats at roughly 1.6% and 1%moisture were stored in 3.6--high, 0.6--diameter cylinders, with or without ventila-tion through perforated oor. Samples (3 ) were placed under 2stream and volatiles trapped on 6/8 mesh (Chromosorb . Volatile levels were higher in the high-moisture wheat (1%) than in the lower-moisture wheat (1.6%). Whereas all three volatiles were detected in freshly harvested wheat (both moisture levels) from nonven-tilated bins, only the former was detected in ventilated bins. In general, volatile productionwas lower in ventilated bins of stored wheat (. The main fungi present included Al- ternaria alternata ,Aspergillus repens , and Penicillium spp. Correlations between biotic and abiotic factors were studied through simple correlation, principal component analysis, and stepwise regression analyses. Levels of 3-methyl-1-butanol, the principal volatile in 2% moisture content wheat, were correlated with bacteria, P