B2-SH-12-D t Centrifugal compressors Cable railways Mater Bevel-helical gear units B2

Flender/Flender Gear Units/Bevel-helical gear units B2

lectrocoat tank or by the paint solid, - minimization of the contacting surface of the coated products before and during the baking Also for bulk goods-coating the phosphatization can be replaced by especially adapted chro- matization with success The obtained results show economical and ecological advantages which give the processvery good marketing chances The economical aspect of the simplified coating compared with conventional technique as well as the totally new coating process for bulkgoods allow to expect demant of industrial appliers by KTL-coating process, 7 Duration: 0 0 8 - 3 0 8 0 VQ2 Subject: Development of processes and equi ment for manufacturing integrated printed conductors gy hot-stamping special copper foils on all types of thermoplastic Research centre: Ivo lrion & Vosseler Zahlerfabrik GmbH & Co Dauchinger Strasse 5 - 6,7 Villingen-Schwenningen Government sponsorship: DM 7,9 0 Sponsorship ratio: 5 / 1. Purpose of the project In orderto avoid electroplating processes in the manufacture of printed circuit boards (PCBs), rocesswasto be developed toapply anytypeof printed conductorto suitablesubstrates, pre- Perably thermoplastics, using the hot-stamping method These printed conductors were to be hot-stam ed onto flat substrates corres onding to common PCBs, as well as onto suitable, not necessariL flat surfaces of all ty es of knctional elements in electrical or electronic devices Processing times in the region orseveral seconds can be expected forthis hot-stamping proc- ess The process has since been patented in Europeand the USA Additional applications have been submitted in the leading industrral nations 2. Working steps The bases of the development were devised in cooperation with the Fraunhofer-Gesellschaft (IGB and IPA). The project plan can be divided into three areas: Part 1 Start-up of semi-industrial test installation for the electroplating of copper foil with the required low ductility Testing and fu